Thick film pastes for the production of electronic circuits and sensors.
Heraeus offers a wide range of pastes for thick film circuits such as gold, silver, palladium, platinum or copper conductive pastes. Dielectrics, over glazes and resistive pastes complete the line of thick film products for hybrid applications.
These recommended pastes (
Hybrid Schematic) meet current environmental demands, such as RoHS; by offering Pb, Cd, and Ni free formulations. Specific formulations for plateable, solderable and wire bondable applications make up the range of commercially available products.
Whenever design space is a premium, environmental conditions are harsh and where reliable circuits are needed – such as in the medical technology sector, the aerospace industry, the automotive industry and in telecommunications, Heraeus thick film pastes are right choice.
Principal processing steps are:
screen printing on temperature resistant ceramic substrates
leveling and drying
firing between 500°C and 1200°C, typically at 850°C.
New Thick Print Copper SystemHeraeus has developed a thick printing
Cu conductor paste system for power electronic applications where excellent print quality, thermal conductivity and soldering properties are required. Heraeus' thick print copper system has been developed to be applied on alumina and some aluminum nitride substrates. The paste has been optimized for 75 micron fired thickness, with one Print-Dry-Fire cycle. Thick Print Copper in combination with
Bonding Pads from the Engineered Materials Division are an attractive alternative to Direct Bond Copper (DBC) based products.
