Product Selector

10-074HF is a silver bearing conductor paste designed to screen print solderable electrodes onto a variety of electical ceramic component devices. Compatible on PZT, NTC thermistors, alumina, steatite and porcelain.

502K08 is a premixed blue LTCC dielectric powder and designed for tape application such as CT 802 tape or other LTCC ceramic substrates which allow the production of multilayer circuits.
502K08 is compatible with Heraeus binder system TOP7750 and other binder systems typically used in tape fabrication. In tape form this material is also compatible with Heraeus silver, gold conductor and resistor systems.

51528 B is a premixed lead free and dark blue LTCC dielectric powder and designed for tape applications such as LTCC and passive component manufacture.

51555 W is a premixed lead free and white LTCC dielectric powder and designed for tape applications such as LTCC and passive component manufacture.

51K65 is a premixed lead free and gray LTCC dielectric powder (K ~ 65) and designed for tape applications such as LTCC and passive component manufacture.

6082 is a reactive (metal oxide) bonded platinum paste, which fires to a dense fired surface. 6082 has a rheology suitable for brushing.

6926 is an unfritted platinum paste, which fires to a pure platinum metal surface. 6926 has a rheology suitable for brushing.

9000 Series Resistor System provides excellent stability, low firing sensistivity and low TCR's.

9000 V Series Resistor System was developed for use in high voltage applications such as focus potentiometers. Values from 100K to 100 Megohm.

9300 Series Resistor System were developed for use in multilayer hybrid circuits. The system provides excellent environmental stability, low firing sensitivity and low TCR's (< 25 ppm). Resistance values range from 100 to 100M Ω/□.

A 3058 B is molecular bonded formulated to provide excellent fired film density, in addition to high conductivity, good solder leach resistance and excellent adhesion.

A 3788 A is a reactive (metal oxide) bonded platinum paste, which fires to a dense platinum surface. A 3788 A has a rheology suitable for brushing.

A 4338 A is an unfritted platinum paste, which fires to a pure platinum surface. A 4338 A has a rheology suitable for brushing.

A 4841-H Blue is a sprayable organo metallic solution for use on different metal alloys. After firing a transparent metal oxide film is achieved. This film works as barrier between metal substrate and metal layer, applied in a second step.

A 6080 XR is a pure Pt paste designed to be used in conjunction with a high fire, high alumina ceramic body.

Ag 300-01 is a chemically precipitated spherical silver powder with a high purity (> 99,9%).

These powders exhibit a tight particle size distribution and excellent dispersion properties.

Ag 300-02 is a chemically precipitated silver powder with a high purity (> 99.9%).

These powders exhibit a wider particle size distribution and a high surface area.

The air dry silvers are used to make non-conductive surfaces electrically and thermally conductive. They can be used in circuit repair or as RF shielding materials. Most can be brushed, sprayed or dipped. These materials will cure at room temperature in 16-20 hours or in 30 minutes at 120-200 degree C. A heat gun will cure the material in seconds. The conductivity of the film can be increased by repeated application of layers.

For use on different metal alloys or high temperature enamels. After firing metallic gold/platinum films are achieved. The films are highly reflective for infra-red radiation and resistant to high temperatures

Au 200-03 is a chemically precipitated spherical Gold powder with a high purity (> 99.9%).

Au 200-09 is a chemically precipitated gold flake powder with a high purity (> 99.9%).

Au 200-30 is a very stable aqueous suspension of high purity of gold particles. The Au content is up to 25 wt. % possible. Au 200-30 is dilutable with deionised water.

B 3745/2 is a thin film conductor paste for use on alumina and glazed alumina. B 3745/2 contains gold and platinum in form of soluble organo metallic compounds.

low cost pure Ag conductor. It has good solderability and very high conductivity. This product is used as the termination for the R 8900 series resistor. It is suitable for RF transmission. Cd and Ni free.

low cost pure Ag conductor. It has good solderability and very high conductivity. This product is used as the termination for the R 8900 D Series resistor for application on dielectric like IP 9117 E. It is suitable for RF transmission. Cd and Ni free.

Ag/Pt low cost solderable conductor that is heavy Al wire bondable. It has high conductivity and is Cd and Ni free. This product is used as a termination for the R 8900 series resistors. Metallizes laser drilled through holes in alumina.

Ag hole plug for alumina substrates.The high solids loading and low shrinkage allows for excellent filling properties with bladder fill machines.

C 1216 is a screen printable 4:1 Ag / Pd conductor paste which exhibits a high density, high reliability and good fine line resolution. It fires to a smooth surface. It is compatible with and solderable upon dielectric IP 9117 Series.

C 2028 is a screen printable 2.8 : 1 Ag / Pd paste which is completely Ni-free. It is compatible with and solderable upon IP 9117 series.

C 2030 is a screen printable 3.0 : 1 Ag / Pd paste which is completely Ni-free. It is compatible with and solderable upon IP 9117 series.

C 2040 is a screen printable 4.0 : 1 Ag / Pd paste which is completely Ni-free. It is compatible with and solderable upon IP 9117 series.

C 2060 is a screen printable 6.0 : 1 Ag / Pd paste which is completely Ni-free. It is compatible with and solderable upon IP 9117 series.

C 2103 M is a Pb and Cd free Ag/Pd conductor which exhibits high density, high reliability and good fine line definition. Preferred material for fuel level sender applications.

High performance, lead, cadmium and nickel free mixed bonded Ag/Pd conductor material. It offers cost savings over standard Ag/Pd formulations while maintaining the advantages of leach resistance and aged adhesion.

Lead, cadmium and nickel free Pd/Ag composition designed for applications where more leach resistance is required. The C2130 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial circuits where more stringent requirements exist. It exhibits excellent solderability, aged adhesion properties and is aluminum wire bondable.

lead, cadmium and nickel free Pd/Ag composition designed for hybrid applications and application where more leach resistance is required. The C2160 conductor is suitable for a wide variety of applications such as automotive electronics, power hybrids and commercial applications where more stringent requirement exist. It exhibits excellent solderability and aged adhesion properties.

lead, cadmium and nickel free Pd/Ag composition designed for automotive applications, with similar electrical and mechanical performance to 6:1 Ag/Pd conductors. The C 2180 conductor is suitable for a wide variety of applications where low cost and excellent performance are required. It exhibits excellent solderability and aged adhesion properties.

C 2210 is a 0.8:1 Ag/Pd pre-alloyed conductor paste which exhibits a high density, high reliability and remarkable fine line resolution. C 2210 has an enriched Pd content to address increased demands by low sulfur fuel applications.

It is a member of the lead free C22xx - series.

C 2220 is a lead free 2.1:1 Ag / Pd conductor paste which exhibits high density, high reliability and good fine line definition.

It fires to a smooth surface and is mechanically durable and chemically resistant. Due to these characteristic C 2220 is a recommended material for application such as fuel sensors.

It is a member of the lead free C22xx Series.

C 2230 is a lead free 3:1 Ag / Pd conductor paste which exhibits a high density, high reliability and good fine line resolution. It fires to a smooth surface and is mechanically durable and chemically resistant.

Due to these characteristic C 2230 is a recommended material for application such as fuel sensors.

It is a member of the lead free C22xx Series.

C 2240 is a lead free 4:1 Ag / Pd conductor paste which exhibits a high density, high reliability and good fine line resolution.

It fires to a smooth surface and is mechanically durable and chemically resistant. Due to these characteristic C 2240 is a recommended material for application such as fuel sensors.

It is a member of the lead free C22xx Series.

C 3605 P and C 3605 S are pastes only consisting of Pt powder and organic vehicle. They are intended to be mixed with customer specific adhesion promoters or to be co-fired with tape.

C 3605 P and C 3605 S can – depending on the exact viscosity which is delivered – be either sprayed / brushed (“P”-version) or screen printed (“S”-version).

C 3606 is a frit-less platinum paste which fires to a catalytic, conductive and stable metallization. C 3606 has a rheology suitable for screen printing. It can be co-fired with green refractory ceramics and forms a dense outer electrode.

C 3657 is a screen printable fritted platinum conductor, which possesses a good conductivity. It is particularly useful for the manufacture of O2 sensors.

This conductor provides outstanding leach resistance and aged adhesion with many types of solder. It has excellent silver migration resistance. It's exceptional coverage makes it cost effective to use.

C 4082 is a Pb and Cd free Ag/Pd/Pt conductor which provides outstanding leach resistance and aged adhesion in a variety of solders. C 4082 has excellent silver migration resistance.

C 4301 GSD (LPA 509-226) is a screen printable 0.8:1 Ag/Pd (alloy) conductor paste which exhibits a high density, high reliability and good fine line resolution.

C 4301 GSD (LPA 509-226) has a high Pd content to address increased demands by low sulfur fuel applications. It is both mechanically durable and chemically very resistant, and is hence a frequently preferred material for e.g. fuel sensors.

Ag/Pd conductor for use in fuel level sensor cards. Resistant to "harsh" fuels and withstands constant wiping. Very high print definition.

C 4303 GSD is a screen printable 2.1:1 Ag/Pd conductor paste which exhibits a high density, high reliability and good fine line resolution.

It fires to a smooth surface and is mechanically durable and chemically resistant. Hence it is a frequently preferred material for e.g. fuel sensors.

C4303M is a low cost paste for fuel senders and is a 2.33/1 Ag/Pd version of C 4303 GSD. This conductor exhibits highdensity, high reliability and good fine line definition, (5mil lines and spaces). It is mechanically durable and chemically resistant. Conductivity, leach resistance, and resistance to silver migration are exceptional. It is frequently a preferred material for fuel sensor applications, particularly in automobiles. C 4303 M fires to a very smooth, dense chemically resistant conductor. The material prints thin about - 11microns FFT.

C 4727 (H) is a lead, nickel and cadmium free 99:1 silver – platinum conductor, designed for low cost applications.

lead, nickel and cadmium free Ag/Pt conductor, designed for automotive applications. C4729 is a member of Heraeus' line of lead free conductors with excellent fired film density, high conductivity, good solder leach resistance and excellent aged adhesion.

C 4741 is a lead, nickel and cadmium free silver-platinum conductor with 1.5 % Pt in the wet paste. It is a new member of Heraeus' line of lead free conductors with excellent fired film density, high conductivity and good solder leach resistance for applications at elevated temperatures.

C 5007 is a wire bondable cadmium-free gold conductor, containing a mixed bonded Au formulation.

It offers excellent aged wire bond adhesion and contact resistivity properties. It is compatible with the recrystallizable dielectric, IP 9117 series, and has been formulated to be resistant to blistering after multiple firings, also when fired together and "on top" of the Heraeus C 2000 nickel-free range of Ag / Pd conductors.

cadmium and lead free gold conductor paste, that has been formulated for use with Au wire bond applications.

High speed auto Au bondable conductor with high density based upon Heraeus' "KQ" powder technology. Ultra high conductivity and print definition to 75 microns. It is specifically designed for Au wire bonding and is capable of resolving 75 micron lines and spaces. C 5755 A is suitable for RF transmission and for "bright fingers" in commercial application. It is Cd free.

high speed auto Au and Al high density conductor based upon Heraeus' "KQ" powder technology. Very high conductivity and print definition to 75 microns. It is specially designed for Au and Al (1.25-25mils) wire bonding and is capable of resolving 75 micron lines and spaces. C 5756 is suitable for "bright fingers" in commercial applications. Can be heavy Al bonded. It is Cd free.

Au via fill for multilayer structures in IP 9117 S / D dielectric.

Au paste designed as plug hole material for stencil printing, Cd-free.

Au paste designed as a hole plug in alumina substrates. The high solids loading allows for excellent filling properties with bladder fill machines. C 5909 has low shrinkage, which allows for a complete fill of the through hole.

Au/Pd/Pt conductor paste for fuel sensor applications. It does not contain Ag, Cd or Ni. C 6011 is optimized in hardness and surface density. It exhibits excellent mechanical resistance after firing.

solderable Au/Pd/Pt conductor paste for fuel sensor applications. It is solderable with customary solder alloys. It does not contain Ag, Cd or Ni. C 6012 is optimized in hardness and surface density. It shows excellent printability resulting in high line definition and smooth surface under various drying conditions. It exhibits very good mechanical resistance after firing.

C 6029 A is a lead and cadmium free Au/Pd/Pt conductor which exhibits excellent solderability and leach resistance for high reliability applications. C 6029 A is Al wirebondable.

900°C firing copper conductor which eliminates silver migration and solder leaching. High conductivity makes it ideal for high power applications.

C 7300/C 7301 is a lead and cadmium free two part copper conductor system developed for applying thick layers of copper.

Screen printable, pure silver paste designed as a hole plug in alumina substrates. The high solids loading allows for excellent filling properties. C8709P has low shrinkage, which allows for a complete fill of the through hole.

An unfritted conductor designed for thick print applications. It exhibits excellent solderability and low resistivity.

C 8717 B is a lead, nickel and cadmium free Ag conductor that yields a smooth, dense film on alumina. This material is recommended for power hybrid applications where high current is a requirement and for large ground plane areas. To achieve needed thickness the paste can be printed in stacked layers up to 300µm.

The paste provides excellent bond adhesion, solderability and good solder leach resistance.

C 8717 E is a lead, nickel and cadmium free pure Ag conductor that yields a smooth, dense film on alumina. The material was designed for thick print applications and a fired film thickness can be achieved up to 200 µm.

C 8717 E is recommended for power hybrid applications where high current is a requirement. C 8717 E is an excellent choice for high conductivity applications that require very thick conductor tracks.

lead, nickel and cadmium free Ag conductor that yields a smooth, dense film on alumina. This material is recommended for general purpose and for large ground plane areas. C8728 provides excellent solderability, void free soldering and good solder leach resistance.

Lead, nickel and cadmium free Ag conductor C 8728 A that yields a smooth, dense film on alumina. This material is recommended for general purpose and large ground plane areas.

lead, nickel and cadmium free plateable silver conductor that yields a smooth, dense film. It exhibits high adhesion. C8729 can be multiple fired without any loss of performance. C 8729 is an excellent choice for plating applications, such as copper, nickel, etc.

low temperature silver conductor, Pb- and Cd-free.

C 8829 B is a low firing lead and cadmium free silver conductor paste. C 8829 B was developed for excellent solderability on the IAMS dielectric system.

Fritless platinum conductor paste that fires to a pure metal surface. Suitable for screenprinting. Cd- & Pb-free.

Fritless platinum conductor paste that fires to a pure metal surface. Suitable for brushing and dipping. Cd- & Pb-free.

CL11-7840 is ceramic filled to reduce shrinkage and fills cavities.

Cadmium and lead free gold conductor paste, that has been formulated to print thin and to have good Au wire bond adhesion.

CL 80-9302 is a Pb free, 460 °C fireable screen printable silver termination developed for Ni/Cr sputtered PTC substrates.

CL 80-9321 is a Pb free, 600 °C fireable screen printable silver termination developed for Ni/Cr sputtered PTC substrates.

CL 80-9372 is a Pb free silver termination material designed for use on NTC thermistors. It is screen printable and has excellent resistance stability after solder and lead attachment.

Ag disc termination for low voltage varistors. It fires @ 650°C and has excellent solderability with non-activated fluxes.

Ag termination material designed for use on NTC Thermistors. Exhibits high adhesion with both low and high temperature solders and gives excellent resistance stability after solder and lead attachment. It fires at 700°C.

Ag disc termination for line voltage varistos. It fires @ 850°C and exhibits excellent electrical characteristics including pulse stability and end of life stability.

Pb- and Cd-free solderable Ag/Pd/Pt end termination designed for use on MLCC (multilayer ceramic chip capacitors). It offers excellent solderability and leach resistance.

Pb-free solderable Ag/Pt end termination designed for use on NPO MLCC (multilayer ceramic chip capacitors). It offers excellent solderability and adhesion. ET1812 A is supplied at a viscosity suitable for machine dip and blot or no-blot applications.

Pb- and Cd-free nickel plateable silver end termination designed to be compatible on a variety of ceramic bodies, including ferrites and multilayer ceramic chip capacitors. Nickel plating can be done without pre-plate processing due to the low glass content on the fired surface. The rheology of ET1833B is suitable for machine dipping.

Pb- and Cd-free silver end termination designed for axial and radial lead attachment to MLCC (multilayer ceramic chip capacitors). ET1845A offers excellent solderability and adhesion. It is supplied at a rheology suitable for machine dip application.

Pb- and Cd-free nickel plateable silver end termination designed to be compatible on Multilayer ceramic chip capacitors (NPO and X7R bodies). Nickel plating can be done without pre-plate processing due to the low glass content on the fired surface.

CL82-8520, CL82-8520A, CL82-8520B, CL82-8520C are anode pastes for fuel cells. CL86-8706, CL86-8706A, CL86-8706B, CL86-8706C are cathode pastes for fuel cells. CL90-8705 is an electrolyte paste for fuel cells.

GG 991BD-H is a sprayable gold solution for use on different

metal alloys. After firing metallic gold films are achieved. The

films are highly reflective for infra-red radiation and resistant

to high temperatures.

The material is suitable for heat reflective layers on quartz glass.

The material is suitable for IR/heat reflective layers on quartz glass.

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IP 065 is a green, screen printable, high temperature overglaze for printing of larger areas. It‘s use is to protect top layer conductor tracks from moisture and works as a solder stop.

IP 211 is a high temperature overglaze for protection of Platinum structures, e.g. sensor applications.

It also can be used to cover Cr-steel with an insulating layer. A clear version is available on demand.

IP 6017 is Pb and Cd free single part dielectric matched to 3000 grade Aluminum substrates.

IP 6075 is Pb and Cd free single part dielectric matched to 3000, 4000, 5000 and 6000 grade Aluminum substrates.

this resistor overglaze is screen-printable and fires to a glossy, green color, for optimum laser-trim charactericstics. it is fully compatible with R 8900 / R 8900 D resistor series, and enhances the stability of such resistors.

Acid resistant overglaze with green color for optimum laser trim characteristics that fires at ~600°C. It was developed for chip resistor applications where Ni and Pb/Sn acid bath solutions are used. Is specifically designed to withstand attack during the plating process.

lead, cadmium and nickel free green overglaze designed for printing and firing over thick film resistors. IP 9035 A provides improved trimmed resistor stability and environmental protection. It has excellent process insensitivity and is compatible with all Heraeus air-fireable resistor series.

lead, nickel and cadmium free acid-resistant overglaze with green color for optimum laser trim characteristics. IP 9036 A was developed for large area printing and chip resistor applications where acid bath solutions are used. It is compatible with C 8728, C 8729 and other Heraeus conductors and the R 8900 series resistors.

IP 9038 A is a Pb, Cd and Ni free green overglaze designed for printing and firing over thick film resistors.

Black passivation glass which fires at ~ 600°C to a smooth, pinhole-free film and resistant to plating solutions. It was designed to be processed over IP 9029 to seal laser trim kerfs.

Acid resistant white marking ink. It can be co-fired or post fired onto IP 9039 (black passivation glass). When co-fired with IP 9039, a smooth top surface will result, allowing for excellent handling by automated pick and place equipment. It has excellent print characteristics for number differentiation and fires at 600°C.

Hermetic multilayer dielectric that can be used in mixed metallurgy applications. This dielectric supports solderable/bondable conductors and provides high stability for the R 8900 D resistors.
IP 9117 E is stabilized in shelf life.

permanent-blue 850°C firing dielectric composition. It withstands harsh conditions such as thermal shock cycling and hot temperature applications to meet requirements of automotive industry. It is Pb-, Cd- and Phtalate-free. Please see the application note for more details.

KQ 150 L is an advanced thick film dielectric, which offers a very low loss factor of 1 x 0,0001 and a dielectric constant of 3.9. It is intented for use in building high performance wireless and microwave structures.

cadmium free, gold conductor paste developed for producing ultra-high density interconnections using a combination of screen printing and etching. This material uses the very latest developments in sub-micron gold powder technology in combination with a special printing vehicle to produce extremely dense fired films with very smooth fired finishes. These properties enable the production of conductor geometries as fine as 10 microns (0.4 mils).

silver conductor paste developed for producing ultra-high density interconnections using a combination of screen-printing and etching. This material will produce extremely dense fired films with very smooth fired finishes. These properties enable the production of conductor geometry's of 50 microns (2 mils), or better.

fritted platinum ink which fires to a catalytic, conductive and stable metallization. Excellent adhesion to zirconia and titania bodies, at a firing temperature of 850-960 °C.

fritted platinum conductor paste. Continous operation at high temperatures (up to 1000 °C) is possible.

It also works as a cofiring paste in LTCC tape.

M 637 C is a pure co-fireable platinum inner electrode paste, for multilayer applications.

PC10904HV is a high performance silver conductor designed for metallizing ceramic component devices. The rheology is optimized for dipping and spraying applications.

PCC11865/PCC11866 is a lead and cadmium free 2-part screen printable, co-fireable silver termination system for use on PTC thermistor discs. PCC11865 is the non-solderable ohmic contact layer. PCC11866 forms the solderable top layer.

PCR 12000 Series is a lead free resistor series that was developed for applications that require firing at lower than 600° C, which makes this series suitable for glass substrates.

This material, when properly cured, yields a chemically inert film, which will not react with circuit components. The cured film exhibits outstanding resistance to solvent attacks and shows a good thermal stability.

This material, when properly cured, yields a chemically inert film, which will not react with circuit components. The cured film exhibits outstanding resistance to solvent attacks and shows a good thermal stability.

This material, when properly cured, yields a chemically inert film, which will not react with circuit components. The cured film exhibits outstanding resistance to solvent attacks and shows a good thermal stability.

This Series material, when properly cured, yields a chemically inert film which will not react with circuit components.

This Series material, when properly cured, yields a chemically inert film which will not react with circuit components.

This Series material, when properly cured, yields a chemically inert film which will not react with circuit components.

Pd 600-03 is a chemically precipitated Palladium powder with a high purity (> 99.9%).

Pt 100-10 is a chemically precipitated Platinum powder with a high purity (> 99.9%).

A low range, lead free, low TCR air-fired resistor system, compatible with lead free Pt/Ag and Pd/Ag conductors. This series gives a dense fired film and was designed to give very tight resistance distribution when cofiring the front and back side of circuits. The series exhibits excellent print resolution for use in typical serpentine layouts. R 400 A Series is laser trimmable and has outstanding power handling capability.

A low range, low TCR air-fired resistor system, compatible with Pt/Ag and Pd/Ag conductors. This series gives a dense fired film and was designed to give very tight resistance distribution when cofiring the front and back side of circuits. The series exhibits excellent print resolution for use in typical serpentine layouts. Heraeus' R400H Series is laser trimmable, has outstanding power handling capability and pulse stability.

Heraeus R 400 L Series is a low range, air- fired resistor system with a low Pd content. This series is compatible with Pt/Ag and Pd/Ag conductors. It gives a dense fired film and was designed to give a very tight resistance distribution when cofiring the front and back side of circuits.

1 Ohm/Sq. to 1 MOhm/Sq., TCR < 100 ppm series for alumina and dielectric. Available in 60 minute and 30 minute firing versions. Termination specific calibrations available on Au, Pt/Ag, Ag/Pd and Ag conductors.

1 Ohm/Sq. to 1 MOhm/Sq., TCR < 100 ppm series for use on dielectric with 60 minute firing profile.

1 Ohm/Sq. to 1 MOhm/Sq., TCR < 100 ppm series for alumina and dielectric. Available in 60 minute and 30 minute firing versions. Termination specific calibrations available on Au, Pt/Ag, Ag/Pd and Ag conductors.

Au resinate paste with 12.5 wt. % Au content for use as thermal print heads, pressure sonsors and etched conductor structures

RP 070107-15% is a thin film conductor paste for use on alumina and glazed alumina.

Ag resinate paste with 22.5 wt. % Ag content for use as fuses, conductors and etched conductor structures

Au resinate paste with 15 wt. % Au content for use as thermal print heads, pressure sonsors and etched conductor structures

RuO2 703-04 is a chemically precipitated powder with a high purity (> 99.9%).

A lead and phthalate free screen printable 850°C firing glaze for insulating Cr steel.

A lead and phthalate free screen printable 850°C firing glaze for protection of steel dielectric and heating tracks

600-650°C firing, hermetic selaing glass designed to seal alumina to alumina.

620-700°C firing sealing glass designed to seal alumina to alumina. It has been engineered for low shrinkage during sealing.

A lead and phthalate free screen printable 850°C firing heating element, applicable on steel dielectric with 25 mΩ/□

A lead and phthalate free screen printable 850°C firing heating element, applicable on steel dielectric with 100 mΩ/□

TC 7101 is a pure Au via fill which provides excellent compatibility with Heratape CT 700 during the cofiring process. TC 7101 is optimized for screen printing or stencil printing of vias.

TC 7102 is a pure Au conductor which provides excellent compatibility with Heratape CT 700 during the cofiring process.

The material may be used to print fine line patterns and can be used as an inner layer as well as a top layer.

TC 7102 can be bonded with Al- and with Au-wire.

TC 7103 is a pure Au conductor which provides excellent compatibility with Heratape CT 700, CT 800 during the cofiring process. TC 7103 is optimized for screen printing of inner layer conductor tracks as well as large ground planes.

TC 7104 is a fritless, silver containing gold conductor material. It provides excellent bonding properties for heavy gold wire.

Because of it’s high solid content high fired thickness can be achieved.

TC 7104 was specifically developed for use as a top conductor on Heratape CT 700 Series, CT 707, CT 708 and CT 800 Series. It exhibits a particularly good adhesion when fired upon these glass-based substrates.

TC 7301 A is a pure Ag via fill which provides excellent compatibility with Heratape during the cofiring process.

TC 7301 A is optimized for stencil printing of vias.

The paste is compatible with other cofiring pasts and with various postfiring pastes.

TC 7302 is a pure Ag conductor with high solid content. It provides excellent compatibility with Heratape CT 700 and CT 800 during the cofiring process.

After firing, the paste can easily be soldered.

TC 7303 is a pure Ag conductor with low solid content. It provides excellent compatibility with Heratape CT 700 and CT 800 during the cofiring process.

TC7304A is a pure Ag via fill which provides excellent compatibility with Heratape CT800 and CT70x during cofiring process.

TC7304A is optimized for stencil printing of vias.

The paste is compatible with other cofiring pastes and with various postfiring pastes.

TC 7306 A is a pure Ag paste developed for plateable top conductor applications.

It provides excellent compatibility with various kinds HERATAPE during the cofiring process.

TC 7306 A is optimized for screen printing of conductor tracks.

The material may readily be used to print fine line patterns.

After firing, the paste can be electroless plated.

TC 7403 is a Ag / Pd via fill (ratio Ag:Pd = 27:1) conductor which provides excellent compatibility with Heratape CT 700 during the cofiring process.

TC 7403 is optimized for stencil printing of vias.

The paste is compatible with other cofiring pastes and with various postfiring pastes.

TC 7404 is a fritted conductor material, with a silver / palladium ratio of 6:1. It is ideal for use as a resistor termination, and exhibits excellent bonding properties with heavy aluminum wire.

TC 7404 was specifically developed for use as a conductor on Heratape CT 700, CT 707 and CT 800. It exhibits a particularly good adhesion when fired upon these glass-based substrates.

TC7406 is a AgPd via-fill (ratio Ag:Pd = 13:1) conductor which provides excellent compatibility with Heratape CT700 during the co-firing process.

TC 7601 is a Ag / Pt conductor which provides excellent compatibility with Heratape CT 800 during the cofiring process.

TC 7601 is optimized for top layer screen printing of conductor tracks.

TC8101 is a pure Au conductor, which provides excellent compatibility with Heratape Clad CT800 and HL2000 during co-firing process.

TC8401 is a fritted AgPd conductor 6:1, which exhibits excellent bonding properties for heavy aluminium wire.

The paste was developed for use as a co-firing conductor on Clad Heratape CT800.

TO2001 is a screen printable dielectric that can be co-fired with CT2000 to act as a solder mask.

TO 7003 is an hermetic dense firing overglaze, particularly developed for use as a protection on resistors on fired substrates made of Heratape CT 700 and CT 800.

Because of the transparent green color adjustment of laser equipment is quick and easy. Resistors can be detected by automatic edge sensing systems.

Drift of Heraeus resistors is remarkably low and is with most of the decades negative when firing this overglaze on top. Therefore it can be easily compensated by laser trimming.

Resistors protected with TO 7003 show excellent long term stability after trimming because of absence of micro cracks.

TO 7003 can also be used as an protective glaze for most of the conductor pastes.

This is a UV curable solder mask/covercoat/dielectric designed for rigid substrates. UVD 5271 offers rapid curing combined with outstanding adhesion and resistance to solvents, moisture, and the soldering process. It is less sensitive to surface cleanliness than other UV curable materials. UVD 5271 has excellent electrical and environmental integrity after soldering and cleaning and outstanding fine line definition, typically 0.008 mils. Heraeus also offers a series of compatible, thermally cured conductors.

V1765E is a premixed blue LTCC powder designed for tape application such as CT800 tape or other LTCC ceramic substrates which allow the production of multilayer circuits.

V1765E is compatible with Heraeus binder system TOP7750. Heraeus offers a complete system of compatible pastes for LTCC tapes.

X200W is a white LTCC powder.